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1 ? fn4831.14 caution: these devices are sensitive to electrosta tic discharge; follow proper ic handling procedures. 1-888-intersil or 888-468-3774 | intersil (and design) is a registered trademark of intersil americas inc. copyright intersil americas inc. 2001-2006. all rights rese rved. rslic18? is a trademark of intersil americas inc. all other trademarks mentioned are the property of their respective owners. hc55185 voip ringing slic family the rslic-voip family of ringing subscriber line interface circuits (rslic) supports analog plain old telephone service (pots) in short and medium loop length, wireless and wireline applications. ideally suited for re mote subscriber units, this family of products offers flexibility to designers with high ringing voltage and low power consumption system requirements. the rslic-voip family operat es to 100v which translates directly to the amount of ringing voltage supplied to the end subscriber. with the high operating voltage, subscriber loop lengths can be extended to 500 (i.e., 5,000 feet) and beyond. other key features across the product family include: low power consumption, ringing using sinusoidal or trapezoidal waveforms, robust auto-detec tion mechanisms for when subscribers go on or off hook, and minimal external discrete application components. integrat ed test access features are also offered on selected products to support loopback testing as well as line measurement tests. there are five product offeri ngs of the hc55185 with each version providing voltage grades of high battery voltage and longitudinal balance. the volt age feed amplifier design uses low fixed loop gains to achieve high analog performance with low susceptibility to system induced noise. block diagram features ? onboard ringing generation ? compatible with existing hc5518x devices ? low standby power consumption (75v, 65mw) ? reduced idle channel noise ? programmable transient current limit ? improved off hook software interface ? integrated mtu dc characteristics ? low external component count ? silent polarity reversal ? pulse metering and on hook transmission ? tip open ground start operation ? balanced and unbalanced ringing ? thermal shutdown with alarm indicator ? 28 lead surface mount packaging ? reduced footprint micro leadframe packaging ? dielectric isolated (di) high voltage design ? qfn package option - compliant to jedec pub95 mo-220 qfn - quad flat no leads - product outline - near chip scale package footprint; improves pcb efficiency and has a thinner profile ? pb-free plus anneal available (rohs compliant) applications ? voice over internet protocol (voip) ? cable modems ? voice over dsl (vodsl) ? short loop access platforms ? remote subscriber units ? terminal adapters related literature ? an9814, user?s guide for development board ? an9824, modeling of the ac loop ? interfacing to dsp codecs (contact factory) ? tb379 thermal characterization of packages for ics ? an9922, thermal characterization and modeling of the rslic18 in the micro leadframe package vrs vrx vtx -in vfb f2 f1 f0 ilim sw- rtd det alm 2-wire port pol cdc vbh vbl bsel swc transient current limit sw+ tip ring tl rd e0 battery switch ringing port 4-wire port test access transmit sensing control logic detector logic dc control data sheet december 18, 2006
2 fn4831.14 december 18, 2006 ordering information part number part marking high battery (vbh) longitudinal balance full test temp. range (c) package pkg. dwg. # 100v 85v 75v 58db 53db hc55185aim* hc55185 aim ??? -40 to +85 28 ld plcc n28.45 hc55185aimz* (note) hc55185 aimz ??? -40 to +85 28 ld plcc (pb-free) n28.45 hc55185bim* hc55185 bim ?? ? -40 to +85 28 ld plcc n28.45 hc55185bimz* (note) hc55185 bimz ?? ? -40 to +85 28 ld plcc (pb-free) n28.45 hc55185cim* hc55185 cim ??? -40 to +85 28 ld plcc n28.45 hc55185cimz* (note) hc55185 cimz ??? -40 to +85 28 ld plcc (pb-free) n28.45 hc55185dim* hc55185 dim ??? -40 to +85 28 ld plcc n28.45 hc55185dimz* (note) hc55185 dimz ??? -40 to +85 28 ld plcc (pb-free) n28.45 hc55185ecm* hc55185 ecm ?? 0 to +75 28 ld plcc n28.45 hc55185ecmz* (note) hc55185 ecmz ?? 0 to +75 28 ld plcc (pb-free) n28.45 hc55185ecr* hc55185 ecr ?? 0 to +75 32 ld qfn l32.7x7** hc55185ecrz* (note) hc55185 ecrz ?? 0 to +75 32 ld qfn (pb-free) l32.7x7** hc55185fcm* hc55185 fcm ??? 0 to +85 28 ld plcc n28.45 hc55185fcmz* (note) hc55185 fcmz ??? 0 to +85 28 ld plcc (pb-free) n28.45 hc55185fcr* hc55185 fcr ??? 0 to +85 32 ld qfn l32.7x7** hc55185fcrz* (note) hc55185 fcrz ??? 0 to +85 32 ld qfn (pb-free) l32.7x7** hc55185gim hc55185 gim ?? -40 to +85 28 ld plcc n28.45 hc55185gimz (note) hc55185 gimz ?? -40 to +85 28 ld plcc (pb-free) n28.45 hc55185gcm hc55185 gcm ??? 0 to +85 28 ld plcc n28.45 hc55185gcmz (note) hc55185 gcmz ??? 0 to +85 28 ld plcc (pb-free) n28.45 hc55185gcr* hc55185 gcr ??? 0 to +85 32 ld qfn l32.7x7** hc55185gcrz* (note) hc55185 gcrz ??? 0 to +85 32 ld qfn (pb-free) l32.7x7** hc5518xeval1 evaluation board platform, including codec. *add "96" suffix for tape and reel **reference ?special considerations for the qfn package? text. note: intersil pb-free plus anneal products em ploy special pb-free material sets; molding compounds/die attach materials and 100 % matte tin plate termination finish, which are rohs compliant and compatible with both snpb and pb-free soldering operations. intersil pb-free p roducts are msl classified at pb-free peak reflow temperatures that meet or ex ceed the pb-free requirements of ipc/jedec j std-020. device operating modes mode f2 f1 f0 e0 = 1 e0 = 0 hc55185a hc55185b hc55185c hc55185d hc55185e hc55185f hc55185g low power standby 0 0 0 shd gkd ??????? forward active 0 0 1 shd gkd ??????? unbalanced ringing 0 1 0 rtd rtd ? reverse active 0 1 1 shd gkd ??????? ringing 1 0 0 rtd rtd ??????? forward loop back 1 0 1 shd gkd ???? ?? tip open 1 1 0 shd gkd ???? ?? power denial 1 1 1 n/a n/a ??????? hc55185
3 fn4831.14 december 18, 2006 pinouts hc55185 (28 ld plcc) top view hc55185 (32 ld qfn) top view ring ilim rtd cdc vrx vrs pol tl bsel rd -in vfb v cc vtx bgnd tip sw- e0 det alm agnd sw+ v bl v bh swc f2 f1 f0 5 6 7 8 9 10 11 12 13 14 15 16 17 18 1 2 3 4 19 20 21 22 23 24 25 26 27 28 v bh v bl bgnd tip nc ring nc rd det alm agnd bsel tl pol vrs nc sw+ sw- swc f2 f1 f0 e0 nc ilim rtd cdc v cc -in vfb vtx vrx 1 2 3 4 5 6 7 8 24 23 22 21 20 19 18 17 32 31 30 29 28 27 26 25 9 10111213141516 hc55185
4 fn4831.14 december 18, 2006 absolute m aximum ratings t a = +25c thermal information maximum supply voltages v cc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5v to +7v v cc - v bh . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110v uncommitted switch voltage . . . . . . . . . . . . . . . . . . . . . . . . -110v maximum tip/ring negative voltage pulse (note 8) . . . . . . vbh -15v maximum tip/ring positive voltage pulse (note 8) . . . . . . . . . . . .+8v esd (human body model). . . . . . . . . . . . . . . . . . . . . . . . . . . . 500v operating conditions temperature range commercial (c suffix) . . . . . . . . . . . . . . . . . . . . . . . . . 0c to +85c industrial (i suffix). . . . . . . . . . . . . . . . . . . . . . . . . . . .-40c to +85c positive power supply (v cc ). . . . . . . . . . . . . . . . . . . . . . . +5v, 5% low battery power supply (v bl ) . . . . . . . . . . . . . -16v to -52v, 5% high battery power supply (v bh ) aim, cim . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v bl to 100v, 5% bim, dim . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v bl to -85v, 10% eim. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v bl to -75v, 10% uncommitted switch (loop back or relay driver) . . . . . +5v to -100v thermal resistance (typical) ja (c/w) jc (c/w) plcc (note 1) . . . . . . . . . . . . . . . . . . . 53 n/a qfn (note 2) . . . . . . . . . . . . . . . . . . . . 27 1 maximum junction temperature plastic . . . . . . . . . . . . . . . +150c maximum storage temperature range . . . . . . . . . -65c to +150c maximum lead temperature (soldering 10s) . . . . . . . . . . . +300c (plcc - lead tips only) for recommended soldering condi tions see tech brief tb389 die characteristics substrate potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v bh process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . bipolar-di caution: stresses above those listed in ?absolute maximum ratings? may cause permanent damage to the device. this is a stress o nly rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. notes: 1. ja for the plcc package is measured with the component mounted on a low effective thermal conductivity test board in free air. se e tech brief tb379 for details. 2. ja for the qfn package is measured in free air with the compon ent mounted on a high effective t hermal conductivity test board wit h direct attach features including conductive thermal vias. jc , the ?case temp? is measured at the center of the exposed metal pad on the package underside. see tech brief 379 and an9922 for additional information and board layout considerations. electrical specifications unless otherwise specified, t a = -40c to +85c for industrial (i) grade and t a = 0c to +85c for commercial (c) grade, v bl = -24v, v bh = -100v, -85v or -75v, v cc = +5v, agnd = bgnd = 0v, loop current limit = 25ma. all ac parameters are specified at 600 2-wire terminating impedance over the frequency band of 300hz to 3.4khz. protection resistors = 0 . parameter test conditions min typ max units ringing parameters vrs input impedance (note 3) 450 - - k differential ringing gain (note 4) ba lanced ringing, vrs to 2-wire, r load = 78 80 82 v/v unbalanced ringing, vrs to 2-wire, r load = 40 v/v centering voltage accuracy tip, referenced to v bh /2 + 0.5 (note 9) - 2.5 - v ring, referenced to v bh /2 + 0.5 - 2.5 - v open circuit ringing voltage balanc ed ringing, vrs input = 0.840v rms -67-v rms unbalanced ringing, vrs input = 0.840v rms 33.5 v rms ringing voltage total distortion r l = 1.3 k , v t-r = |v bh | -5 - - 4.0 % 4-wire to 2-wire ringing off isolation a ctive mode, referenced to vrs input - 90 - db 2-wire to 4-wire transmit isolation ri nging mode referenced to the differential ringing amplitude -80- db ac transmission parameters receive input impedance (note 3) 160 - - k transmit output impedance (note 3) --1 4-wire port overload level (note 3) thd = 1% 3.1 3.5 - v peak 2-wire port overload level (note 3) thd = 1% 3.1 3.5 - v peak 2-wire return loss 300hz - 24 - db 1khz - 40 - db 3.4khz - 21 - db hc55185
5 fn4831.14 december 18, 2006 2-wire longitudinal balance (notes 5, 6) forward active, grade a and b 58 62 - db forward active, grade c, d and e 53 59 - db 4-wire longitudinal balance (notes 5, 6) forward active, grade a and b 58 67 - db forward active, grade c, d and e 53 64 - db 2-wire to 4-wire level linearity 4-wire to 2-wire level linearity referenced to -10dbm +3 to -40dbm, 1khz - 0.025 - db -40 to -50dbm, 1khz - 0.050 - db -50 to -55dbm, 1khz - 0.100 - db longitudinal current capability per wire (note 3) test for false detect 20 - - ma rms test for false detect, low power standby 10 - - ma rms 4-wire to 2-wire insertion loss -0.20 0.00 +0.20 db 2-wire to 4-wire insertion loss -6.22 -6.02 -5.82 db 4-wire to 4-wire insertion loss -6.22 -6.02 -5.82 db forward active idle channel noise (note 6) 2-wire c-message, t = +25c - 10 13 dbrnc 4-wire c-message, t = +25c - 4 7 dbrnc reverse active idle channel noise (note 6) 2-wire c-message, t = +25c - 11 14 dbrnc 4-wire c-message, t = +25c - 5 8 dbrnc dc parameters off hook loop current limit programming accuracy -8.5 - +8.5 % programming range 15 - 45 ma off hook transient current limit programming accuracy -10 - +10 % programming range 40 - 100 ma loop current during low power standby forward polarity only 18 - 26 ma open circuit voltage (|tip - ring|) v bl = -16v - 8.0 - v dc v bl = -24v 14 15.5 17 v dc v bh > -60v 43 49 - v dc low power standby, open circuit voltage (tip - ring) v bl = -48v - 44.5 - v dc v bh > -60v 43 51.5 - v dc absolute open circuit voltage v rg in lps and fa; v tg in ra; v bh > -60v - -53 -56 v dc test access functions switch on voltage i ol = 45ma - 0.30 0.60 v loopback max battery --52v loop detectors and supervisory functions switch hook programming range 5-15ma switch hook programming accuracy assumes 1% external programming resistor -10 - +10 % dial pulse distortion -1.0- % ring trip comparator threshold 2.3 2.5 2.9 v ring trip programming current accuracy -10 - +10 % ground key threshold -12- ma e0 transition, det output delay -20- s thermal alarm output ic junction temperature - 175 - c logic inputs (f0, f1, f2, e0, swc, bsel) input low voltage --0.8v input high voltage 2.0 - - v input low current v il = 0.4v -20 -10 - a electrical specifications unless otherwise specified, t a = -40c to +85c for industrial (i) grade and t a = 0c to +85c for commercial (c) grade, v bl = -24v, v bh = -100v, -85v or -75v, v cc = +5v, agnd = bgnd = 0v, loop current limit = 25ma. all ac parameters are specified at 600 2-wire terminating impedance over the frequency band of 300hz to 3.4khz. protection resistors = 0 . (continued) parameter test conditions min typ max units hc55185 1
6 fn4831.14 december 18, 2006 input high current v ih = 2.4v - - 1 a logic outputs (det , alm ) output low voltage i ol = 5ma - 0.15 0.4 v output high voltage i oh = 100 a2.43.5-v supply currents low power standby, bsel = 1 i cc -3.96.0ma i bh - 0.66 0.90 ma forward or reverse active , bsel = 0 i cc -4.96.5ma i bl -1.22.5ma forward active, bsel = 1 i cc -7.09.5ma i bl -0.92.0ma i bh -2.23.0ma ringing, bsel = 1 (balanced ringing, 100) i cc -6.49.0ma i bl -0.31.0ma i bh -2.03.0ma ringing, bsel = 1 (unbalanced ringing, 010) i cc -9.3 ma i bl -0.3 ma i bh -2.4 ma forward loopback, bsel = 0 i cc - 10.3 13.5 ma i bl - 23.5 32 ma tip open, bsel = 0 i cc -3.85.5ma i bl -0.31.0ma power denial, bsel = 0 or 1 i cc -4.06.0ma i bl - 0.22 0.5 ma on hook power dissipation (note 7) forward or reverse v bl = -24v - 55 - mw low power standby v bh = -100v - 85 - mw v bh = -85v - 75 - mw v bh = -75v - 65 - mw ringing v bh = -100v - 250 - mw v bh = -85v - 230 - mw v bh = -75v - 225 - mw off hook power dissipation (note 7) forward or reverse v bl = -24v - 305 - mw power supply rejection ratio v cc to 2-wire f = 300hz - 40 - db f = 1khz - 35 - db f = 3.4khz - 28 - db v cc to 4-wire f = 300hz - 45 - db f = 1khz - 43 - db f = 3.4khz - 33 - db v bl to 2-wire 300hz f 3.4khz - 30 - db v bl to 4-wire 300hz f 3.4khz - 35 - db v bh to 2-wire 300hz f 3.4khz - 33 - db electrical specifications unless otherwise specified, t a = -40c to +85c for industrial (i) grade and t a = 0c to +85c for commercial (c) grade, v bl = -24v, v bh = -100v, -85v or -75v, v cc = +5v, agnd = bgnd = 0v, loop current limit = 25ma. all ac parameters are specified at 600 2-wire terminating impedance over the frequency band of 300hz to 3.4khz. protection resistors = 0 . (continued) parameter test conditions min typ max units hc55185
7 fn4831.14 december 18, 2006 special considerations for the qfn package the new qfn package offers a si gnificant footprint reduction (65%) and improved thermal performance with respect to the 28 lead plcc. to realize the thermal enhancements and maintain the high voltage (-100v) performance, the exposed leadframe should be soldered to a power/heat sink plane that is electrically connect ed to the high battery supply (v bh ) within the application board. this approach distributes the heat evenly across the board and is accomplished by using conductive thermal vias. reference technical brief tb379 and an9922 for additional information on thermal characterization and board layout considerations. product family cross reference the following table provides an ordering and functional cross reference for the existing hc55180 through hc55184 products and the new and improved hc55185 product. any of the hc55185 products may be used without the battery switch function by shorting the supply pins vbl and vbh together. this provides compatibility with hc55180 type applications which do not require the battery switch. application circuit modifications the hc55185 basic application circuit is nearly identical to that of the hc55180 through hc55184. the hc55185 requires an additional resistor to program the transient current limit feature. this progr amming resistor is connected from pin 16 (tl) to ground. in addition some component values have been changed to improve overall device performance. the table below lists the component value changes required for the hc55185 application circuit. the value of rs is based on a 600 termination impedance and rp1 = rp2 = 49.9 . design equations are provided to calculate rs for other combin ations of termination and protection resistance. the cfb capacitor must be non-polarized for proper device operation in reverse active. ceramic surface mount capacitors (1206 body style) are available from panasonic with a 6.3v voltage rating. these can be used for cfb since it is internally limited to approximately 3v. the cdc capacitor may be either polarized or non polarized. parametric improvements the most significant parame tric improvement of the hc55185 is reduction in idle channel noise. this improvement was accomplished by redistributing gains in the impedance matching loop. th e impact to the application circuit is the change in the impedance programming resistor rs. the redistribution of gains also improves ac performance at the upper end of the voice band. v bh to 4-wire 300hz f 1khz - 40 - db 1khz < f 3.4khz - 45 - db notes: 3. these parameters are controlled via design or process parameters and are not directly tested. these parameters are characteri zed upon initial design release and upon design changes which would affect these characteristics. 4. differential ringing gain is measured with vrs = 0.795v rms for -100v devices, vrs = 0.663 v rms for -85v devices and vrs = 0.575v rms for -75v devices. 5. longitudinal balance is tested per ieee455-1985, with 368 per tip and ring terminal. 6. these parameters are tested 100% at room temperature. these parameters are guaranteed not tested across temperature via stati stical characterization and design. 7. the power dissipation is based on actual device measurements and will be less than wo rst case calculations based on data shee t supply current limits. 8. characterized with 2 x 10 s, and 10 x 1000 s first level lightning surge waveforms (gr-1089-core) 9. for unbalanced ringing the tip terminal is offset to 0v and the ring terminal is centered at vbh/2 + 0.5v. electrical specifications unless otherwise specified, t a = -40c to +85c for industrial (i) grade and t a = 0c to +85c for commercial (c) grade, v bl = -24v, v bh = -100v, -85v or -75v, v cc = +5v, agnd = bgnd = 0v, loop current limit = 25ma. all ac parameters are specified at 600 2-wire terminating impedance over the frequency band of 300hz to 3.4khz. protection resistors = 0 . (continued) parameter test conditions min typ max units table 1. product cross reference existing devices functional equivalent hc55180cim, hc55180dim none offered hc55181aim, hc55182aim hc55185aim hc55181bim, hc55182bim hc55185bim hc55181cim, hc55182cim hc55185cim hc55181dim, hc55182dim hc55185dim hc55183ecm, hc55184ecm hc55185ecm table 2. component value changes reference hc55180 - 184 hc55185 rs 210k 66.5k rp1 35 ? 49 rp2 35 ? 49 cfb 0.47 4.7 hc55185
8 fn4831.14 december 18, 2006 functional improvements in addition to parametric improvements, internal circuit changes and application circuit changes have been made to improve the overall device functionality. off hook interface the transient behavior of the device in response to mode changes has been significantly improved. the benefit to the application is reduction or more likely elimination of det glitches when off hook events occur. in addition to internal circuit modifications, the change of cfb value contributes to this functional improvement. transient current limit the drive current capability of the output amplifiers is determined by an externally programmable output current limit circuit which is separate from the dc loop current limit function and programmed at t he pin tl. the current limit circuit works in both the source and sink direction, with an internally fixed offset to prev ent the current limit functions from turning on simultaneously. the current limit function is provided by sensing line current and reducing the voltage drive to the load when the externally set threshold is exceeded, hence forcing a consta nt source or sink current. source current programming the source current is externally programmed as shown in equation 1. for example a source current limit setting of 50ma is programmed with a 35.6k resistor connected from pin 16 of the device to ground. this setting determines the maximum amount of current which flows from tip to ring during an off hook event until the dc loop current limit responds. in addition this setting also determines the amount of current which will flow from tip or ring when external battery faults occur. sink current programming the sink current limit is internal ly offset 20% higher than the externally programmed source current limit setting. if the source current limit is se t to 50ma, the sink current limit will be 60ma. this setting will determine the maximum current that flows into tip or ring when external ground faults occur. functional description each amplifier is designed to limit source current and sink current. the diagram below shows the functionality of the circuit for the case of limiting the source current. a similar diagram applies to the sink current limit with current polarity changed accordingly. during normal operation, the error current (i err ) is zero and the output voltage is determi ned by the signal current (i sig ) multiplied by the 200k feedback resistor. with the current polarity as shown for i sig , the output voltage moves positive with respect to half battery. assuming the amplifier output is driving a load at a more neg ative potential, the amplifier output will source current. during excessive output sour ce current flow, the scaled output current (i o /k) exceeds the reference current (i ref ) forcing an error current (i err ). with the polarity as shown the error current subtracts from the signal current, which reduces the amplifier output vo ltage. by reducing the output voltage the source current to the load is decreased and the output current is limited. determining the proper setting since this feature programs the maximum output current of the device, the setting must be high enough to allow for detection of ring trip or programmed off hook loop current, whichever is greater. to allow for proper ring trip operation, the transient current limit setting should be set at least 25% higher than the peak ring trip current setting. setting the transient current 25% higher should account for programming tolerances of both the ring trip threshold and the transient current limit. if loop current is larger than ring trip current (low ren applica- tions) then the transient current limit should be set at least 35% higher than the loop current settin g. the slightly higher offset accounts for the slope of the loop current limit function. attention to detail should be exercised when programming the transient current lim it setting. if ring trip detect does not occur while ringing, then re-examine the transient current limit and ring trip threshold settings. r tl 1780 i src ------------- = (eq. 1) i snk 1.20 i src = (eq. 2) figure 1. current limit functional diagram tip or ring + - i ref = 1.21/tl i o i o /k i err i sig 20 200k vb/2 hc55185
9 fn4831.14 december 18, 2006 design equations loop supervision thresholds switch hook detect the switch hook detect threshold is set by a single external resistor, r sh . equation 3 is used to calculate the value of r sh . the term i sh is the desired dc loop current threshold. the loop current threshold programming range is from 5ma to 15ma. ground key detect the ground key detector senses a dc current imbalance between the tip and ring terminals when the ring terminal is connected to ground. the ground key detect threshold is not externally programmable and is internally fixed to 12ma regardless of the switch hook threshold. ring trip detect the ring trip detect threshold is set by a single external resistor, r rt . i rt should be set between the peak ringing current and the peak off hook current while still ringing. in addition, the ring trip current must be set below the transient current limit, including tolerances. the capacitor c rt , in parallel with r rt , will set the ring trip response time. loop current limit the loop current limit of the device is programmed by the external resistor r il . the value of r il can be calculated using equation 5: the term i lim is the desired loop current limit. the loop current limit programming range is from 15ma to 45ma. impedance matching the impedance of the device is programmed with the external component r s . r s is the gain setting resistor for the feedback amplifier that provides impedance matching. if complex impedance matching is required, then a complex network can be substituted for r s . resistive impedance synthesis the source impedance of the device, z o , can be calculated in equation 6. the required impedance is defined by the terminating impedance and protection resistors as shown in equation 7. 4-wire to 2-wire gain the 4-wire to 2-wire gain is defined as the receive gain. it is a function of the terminati ng impedance, synthesized impedance and protection resist ors. equation 8 calculates the receive gain, g 42 . when the device source impe dance and protection resistors equals the terminating impedance, the receive gain equals unity. 2-wire to 4-wire gain the 2-wire to 4-wire gain (g 24 ) is the gain from tip and ring to the vtx output. the transmit gain is calculated in equation 9. when the protection resistors are set to zero, the transmit gain is -6db. transhybrid gain the transhybrid gain is defined as the 4-wire to 4-wire gain (g 44 ). when the protection resistors ar e set to zero, the transhybrid gain is -6db. complex impedance synthesis substituting the impedance programming resistor, r s , with a complex programming network provides complex impedance synthesis. the reference designators in the programming network match the evaluation board. the component r s has a different design equation than the r s used for resistive impedance synthesis. the design equations for each component are provided below. r sh 600 i sh ? = (eq. 3) r rt 1800 i rt ? = (eq. 4) r il 1760 i lim ------------ - = (eq. 5) r s 133.3 z o () = (eq. 6) z o z l 2r p ? = (eq. 7) g 42 2 z l z o + 2r p + z l ----------------------------------------- - ?? ?? ?? ? = (eq. 8) g 24 z o z o + 2r p + z l ----------------------------------------- - ?? ?? ?? ? = (eq. 9) g 44 z o z o 2r p z l ++ -------------------------------------- - ?? ?? ?? ? = (eq. 10) figure 2. complex programming network 2-wire network r 1 r 2 c 2 programming network r series r parallel c parallel r series 133.3 r 1 2r p () ? () = (eq. 11) r parallel 133.3 r 2 = (eq. 12) c parallel c 2 133.3 ? = (eq. 13) hc55185
10 fn4831.14 december 18, 2006 low power standby overview the low power standby mode (lps, 000) should be used during idle line conditions. the device is designed to operate from the high battery during this mode. most of the internal circuitry is powered down, resulting in low power dissipation. if the 2-wire (tip/ring) dc voltage requirements are not critical during idle line conditions, the device may be operated from the low battery. operation from the low battery will decrease the standby power dissipation. 2-wire interface during lps, the 2-wire interface is maintained with internal switches and voltage references. the tip and ring amplifiers are turned off to conserve power. the device will provide mtu compliance, loop cu rrent and loop supervision. figure 3 represents the internal circuitry providing the 2-wire interface during low power standby. mtu compliance maintenance termination unit or mtu compliance places dc voltage requirements on the 2-wire terminals during idle line conditions. the minimum idle voltage is 42.75v. the high side of the mtu range is 56v. the voltage is expressed as the difference between tip and ring. the tip voltage is held near ground through a 600 resistor and switch. the ring voltage is limited to a maximum of -56v (by mtu ref) when operat ing from either the high or low battery. a switch and 600 resistor connect the mtu reference to the ring terminal. when the high battery voltage exceeds the mtu reference of -56v, the ring terminal will be clamped by the internal reference (typically -54v). the same ring relationships apply when operating from the low battery voltage. for high battery voltages (v bh ) less than or equal to the internal mtu reference threshold: loop current during lps, the device will pr ovide current to a load. the current path is through resistors and switches, and will be function of the off hook loop resistance (r loop ). this includes the off hook phone resistance and copper loop resistance. the current available during lps is determined by equation 15. internal current limiting of the standby switches will limit the maximum current to 20ma. another loop current related parameter is longitudinal current capability. the longitudinal current capability is reduced to 10ma rms per pin. the reduction in longitudinal current capability is a result of turning off the tip and ring amplifiers. on hook power dissipation the on hook power dissipation of the device during lps is determined by the operating voltages and quiescent currents and is calculated using equation 16. the quiescent current terms are specified in the electrical tables for each operating mode. load power dissipation is not a factor since this is an on hook mode. some applications may specify a standby current. the standby current may be a charging current required for modern telephone electronics. standby current power dissipation any standby line current, i slc , introduces an additional power dissipation term p slc . equation 17 illustrates the power contribution is zero when the standby line current is zero. if the battery voltage is less than -49v (the mtu clamp is off), the standby line current power contribution reduces to equation 18. most applications do not specify charging current requirements during standby. when specified, the typical charging current may be as high as 5ma . table 3. device interfaces during lps interface on off notes receive x ac transmission, impedance matching and ringing are disabled during this mode. ringing x transmit x 2-wire x amplifiers disabled. loop detect x switch hook or ground key. figure 3. lps 2-wire interface circuit diagram tip amp ring amp tip ring mtu ref gnd 600 600 v ring v bh 4 + = (eq. 14) i loop 1 ? 49 ? () ? () 600 600 r loop ++ () ? = (eq. 15) p lps v bh i bhq v bl i blq v cc i ccq ++ = (eq. 16) p slc i slc v bh 49 ? 1i slc x1200 ++ () = (eq. 17) p slc i slc v bh 1i slc x1200 ++ () = (eq. 18) hc55185
11 fn4831.14 december 18, 2006 forward active overview the forward active mode (fa, 001) is the primary ac transmission mode of the device. on hook transmission, dc loop feed and voice transmission are supported during forward active. loop supervision is provided by either the switch hook detector (e0 = 1) or the gr ound key detector (e0 = 0). the device may be operated from eit her high or low battery for on- hook transmission and low battery for loop feed. on-hook transmission the primary purpose of on hook transmission will be to support caller id and other advanced signalling features. the transmission over load level while on hook is 3.5v peak . when operating from the high battery, the dc voltages at tip and ring are mtu compliant. the typical tip voltage is -4v and the ring voltage is a function of the battery voltage for battery voltages less than -60v as shown in equation 19. loop supervision is provided by the switch hook detector at the det output. when det goes low, the low battery should be selected for dc loop feed and voice transmission. feed architecture the design implements a voltage feed current sense architecture. the device controls the voltage across tip and ring based on the sensing of load current. resistors are placed in series with tip and ring outputs to provide the current sensing. the diagram below illustrates the concept. by monitoring the current at th e amplifier output, a negative feedback mechanism sets the output voltage for a defined load. the amplifier gains are set by resistor ratios (r a , r b , r c ) providing all the perfor mance benefits of matched resistors. the internal sense resistor, r cs , is much smaller than the gain resistors and is typically 20 for this device. the feedback mechanism, k s , represents the amplifier configuration providin g the negative feedback. dc loop feed the feedback mechanism for monitoring the dc portion of the loop current is the loop detector. a low pass filter is used in the feedback to block voice band signals from interfering with the loop current limit function. the pole of the low pass filter is set by the external capacitor c dc . the value of the external capacitor should be 4.7 f. most applications will operat e the device from low battery while off hook. the dc feed characteristic of the device will drive tip and ring towards half battery to regulate the dc loop current. for light loads, tip will be near -4v and ring will be near v vbl + 4v. the following diagram shows the dc feed characteristic. the point on the y-axis labeled v tr(oc) is the open circuit tip to ring voltage and is defined by the feed battery voltage. the curve of figure 5 determi nes the actual loop current for a given set of loop conditions. the loop conditions are determined by the low battery voltage and the dc loop impedance. the dc loop impedance is the sum of the protection resistance, copper resistance ( /foot) and the telephone off hook dc resistance. the slope of the feed characteristic and the battery voltage define the maximum loop current on the shortest possible loop as the short circuit current i sc . the term i lim is the programmed current limit, 1760/r il . the line segment i a represents the constant current region of the loop current limit function. the maximum loop impedance for a programmed loop current is defined as r knee . v ring v bh 4 + = (eq. 19) figure 4. voltage feed current sense diagram + - + - v in v out r c r cs r l r b r a k s figure 5. dc feed characteristic m = ( v tr / i l ) = 11.1k i loop (ma) i lim v tr(oc) v tr , dc (v) v tr oc () v bl 8 ? = (eq. 20) figure 6. i loop vs r loop load characteristic r loop ( ) r knee i lim i loop (ma) i sc i a i b 2r p i sc i lim v tr oc () 2r p i lim ? 1.1e4 ----------------------------------------------------- - + = (eq. 21) i a i lim v tr oc () r loop i lim ? 1.1e4 -------------------------------------------------------------- + = (eq. 22) r knee v tr oc () i lim ------------------------ = (eq. 23) hc55185
12 fn4831.14 december 18, 2006 when r knee is exceeded, the device will transition from constant current feed to consta nt voltage, resistive feed. the line segment i b represents the resist ive feed portion of the load characteristic. voice transmission the feedback mechanism for monitoring the ac portion of the loop current consists of two amplifiers, the sense amplifier (sa) and the transmit amplifier (ta). the ac feedback signal is used for impedance synthesis. a detailed model of the ac feed back loop is provided below. the gain of the transmit amplifier, set by r s , determines the programmed impedance of the device. the capacitor c fb blocks the dc component of the loop current. the ground symbols in the model represent ac grounds, not actual dc potentials. the sense amp output voltage, v sa , as a function of tip and ring voltage and load is calculated using equation 25. the transmit amplifier provides the programmable gain required for impedance synthesis. in addition, the output of this amplifier interfaces to the codec transmit input. the output voltage is calculated using equation 26. once the impedance matching components have been selected using the design equ ations, the above equations provide additional insight as to the expected ac node voltages for a specific tip and ring load. transhybrid balance the final step in completing the impedance synthesis design is calculating the necessary gains for transhybrid balance. the ac feed back loop produces an echo at the v tx output of the signal injected at v rx . the echo must be cancelled to maintain voice quality. most applications will use a summing amplifier in the codec front end as shown below to cancel the echo signal. the resistor ratio, r f /r b , provides the final adjustment for the transmit gain, g tx . the transmit gain is calculated using equation 27. most applications set r f = r b , hence the device 2-wire to 4-wire equals the transmit gain. typically r b is greater than 20k to prevent loading of the device transmit output. the resistor ratio, r f /r a , is determined by the transhybrid gain of the device, g 44 . r f is previously defined by the transmit gain requirement and r a is calculated using equation 28. power dissipation the power dissipated by the device during on hook transmission is strictly a function of the quiescent currents for each supply voltage during forward active operation. off hook power dissipation is increased above the quiescent power dissipation by the dc load. if the loop length is less than or equal to r knee , the device is providing constant current, i a , and the power dissipation is calculated using equation 30. if the loop length is greater than r knee , the device is operating in the constant voltage, resistive feed region. the power dissipated in this region is calculated using equation 31. i b v tr oc () r loop ------------------------ = (eq. 24) figure 7. ac signal transmission model tip ring + - -in vfb vrx vtx r r r r + - + - + - 1:1 20 20 3r 4r 4r 4r 4r 3r 8k r s c fb t a v sa v sa v t v r ? () ? 30 z l ------ = (eq. 25) v vtx v sa r s 8e3 ---------- ?? ?? ? = (eq. 26) figure 8. transhybrid balance interface + - r f r b r a hc5518x codec +2.4v rx out tx in -in vrx vtx r r + - 1:1 r s t a g tx g ? 24 r f r b ------- - ?? ?? ?? = (eq. 27) r a r b g 44 ---------- = (eq. 28) p faq v bh i bhq v bl i blq v cc i ccq ++ = (eq. 29) p fa ia () p fa q () v bl xi a () r loop xi 2 a () ? + = (eq. 30) p fa ib () p fa q () v bl xi b () r loop xi 2 b () ? + = (eq. 31) hc55185
13 fn4831.14 december 18, 2006 since the current relationships are different for constant current versus constant vo ltage, the region of device operation is critical to valid power dissipation calculations. reverse active overview the reverse active mode (ra, 011) provides the same functionality as the forward active mode. on hook transmission, dc loop feed and voice transmission are supported. loop supervision is pr ovided by either the switch hook detector (e0 = 1) or the ground key detector (e0 = 0). the device may be operated from either high or low battery. during reverse active the tip and ring dc voltage characteristics exchange roles. that is, ring is typically 4v below ground and tip is typically 4v more positive than battery. otherwise, all f eed and voice transmission characteristics are identical to forward active. silent polarity reversal changing from forward active to reverse active or vice versa is referred to as polarity reversal. many applications require slew rate control of the polarity reversal event. requirements range from minimizing cross talk to protocol signalling. the device uses an external low voltage capacitor, c pol , to set the reversal time. once programmed, the reversal time will remain nearly constant over various load conditions. in addition, the reversal timing capacitor is isolated from the ac loop, therefore loop stability is not impacted. the internal circuitry used to se t the polarity re versal time is shown below. during forward active, the current from source i1 charges the external timing capacitor c pol and the switch is open. the internal resistor provides a clamping function for voltages on the pol node. during reverse active, the switch closes and i2 (roughly twice i1) pulls current from i1 and the timing capacitor. the current at the pol node provides the drive to a differential pair which controls the reversal time of the tip and ring dc voltages. where time is the required reversal time. polarized capacitors may be used for c pol . the low voltage at the pol pin and minimal voltage excursion 0.75v, are well suited to polarized capacitors. power dissipation the power dissipation equations for forward active operation also apply to the reverse active mode. ringing overview the ringing mode (rng,100) provides linear amplification to support a variety of ringing waveforms. a programmable ring trip function provides loop supervision and auto disconnect upon ring trip. the device is designed to operate from the high battery during this mode. architecture the device provides linear amplif ication to the signal applied to the ringing input, v rs . the differential ringing gain of the device is 80v/v. the circuit model for the ri nging path is shown in figure 10. the voltage gain from the vrs input to the tip output is 40v/v. the resistor ratio provides a gain of 8 and the current mirror provides a gain of 5. the voltage gain from the vrs input to the ring output is -4 0v/v. the equations for the tip and ring outputs during ringing are provided below. when the input signal at vrs is zero, the tip and ring amplifier outputs are centered at half battery. the device provides auto centering fo r easy implementation of sinusoidal ringing waveforms. both ac and dc control of the tip and ring outputs is available during ringing. this feature allows for dc offsets as pa rt of the ringing waveform. ringing input the ringing input, v rs , is a high impedance input. the high impedance allows the use of low value capacitors for ac coupling the ring signal. the v rs input is enabled only during the ringing mode, therefor e a free running oscillator may be connected to vrs at all times. figure 9. reversal timing control c pol pol i 1 75k i 2 c pol time 75000 ---------------- = (eq. 32) figure 10. linear ringing model tip ring v rs r/8 r r + - + - 5:1 20 20 + - + - 600k v bh 2 v t v bh 2 ----------- 40 vrs () + = (eq. 33) v r v bh 2 ----------- 40 vrs () ? = (eq. 34) hc55185
14 fn4831.14 december 18, 2006 when operating from a battery of -100v, each amplifier, tip and ring, will swing a maximum of 95v p-p . hence, the maximum signal swing at vrs to achieve full scale ringing is approximately 2.4v p-p . the low signal levels are compatible with the output voltage range of the codec. the digital nature of the codec ideally su its it for the function of programmable ringing generator. see applications section. logic control ringing patterns consist of sil ent intervals. the ringing to silent pattern is called the ringing cadence. during the silent portion of ringing, the device can be programmed to any other operating mode. the most likely candidates are low power standby or forward active. depending on system requirements, the low or high battery may be selected. loop supervision is provided with the ring trip detector. the ring trip detector senses the change in loop current when the phone is taken off hook. the loop detector full wave rectifies the ringing current, which is then filtered with external components r rt and c rt . the resistor r rt sets the trip threshold and the capacitor c rt sets the trip response time. most applications will require a trip response time less than 150ms. three very distinct actions occur when the devices detects a ring trip. first, the det output is latched low. the latching mechanism eliminates the need for software filtering of the detector output. the latch is cleared when the operating mode is changed externally. second, the vrs input is disabled, removing the ring signal from the line. third, the device is internally forced to the forward active mode. power dissipation the power dissipation during ringing is dictated by the load driving requirements and the ringing waveform. the key to valid power calculations is the correct definition of average and rms currents. the average current defines the high battery supply current. the rms current defines the load current. the cadence provides a time averaging reduction in the peak power. the total power dissipation consists of ringing power, p r , and the silent interval power, p s . the terms t r and t s represent the cadence. the ringing interval is t r and the silent interval is t s . the typical cadence ratio t r :t s is 1:2. the quiescent power of the device in the ringing mode is defined in equation 36. the total power during the ringing interval is the sum of the quiescent power and loading power: for sinusoidal waveforms, the average current, i avg , is defined in equation 38. the silent interval power dissipation will be determined by the quiescent power of th e selected operating mode. unbalanced ringing the hc55185gcm offers a new unbalanced ringing mode (010). this feature has been added to accommodate some analog pbx trunk lines that require the ti p terminal to be held near ground for the duration of the ringing bursts. the tip terminal is offset to 0v?s wi th an internal current source that is applied to the inverting input of the tip amplifier. this reduces the differential ringing gain to 40v/v. the ring terminal will center at vbh/2 and swing from -vbh to ground. as in balanced ringing, off hook detection is accomplished by sensing the peak current and comparing it to a preset threshold. this allows the same sensing, comparing and threshold circuitry to be used in both ringing modes. this mode of operation does not require any additional external components. forward loop back overview the forward loop back mode (flb, 101) provides test capability for the device. an internal signal path is enabled allowing for both dc and ac verification. the internal 600 terminating resistor has a tolerance of 20%. the device is intended to operate from only the low battery during this mode. architecture when the forward loop back mode is initiated internal switches connect a 600 load across the outputs of the tip and ring amplifiers. dc verification when the internal signal path is provided, dc current will flow from tip to ring. the dc current will force det low, indicating the presence of loop current. in addition, the alm output will also go low. this does not indicate a thermal alarm condition. rather, proper logic operation is verified in the event of a thermal shutdown. in addition to verifying device functionality, toggling the logic outputs verifies the interface to the system controller. p rng p r t r t r t s + -------------- p s t s t r t s + -------------- + = (eq. 35) p rq () v bh i bhq v bl i blq v cc i ccq ++ = (eq. 36) p r p rq () v bh i avg v rms 2 z ren r loop + ------------------------------------------ ? + = (eq. 37) i avg 2 -- - ?? ?? v rms 2 z ren r loop + ------------------------------------------ = (eq. 38) figure 11. forward loop back internal termination ring amp tip amp ring tip 600 hc55185
15 fn4831.14 december 18, 2006 ac verification the entire ac loop of the device is active during the forward loop back mode. therefore a 4-wire to 4-wire level test capability is provided. depending on the transhybrid balance implementation, test coverage is provided by a one or two step process. system architectures which ca nnot disable the transhybrid function would require a two step process. the first step would be to send a test tone to the device while on hook and not in forward loop back mode. the return signal would be the test level times the gain r f /r a of the transhybrid amplifier. since the device would not be terminated, cancellation would not occur. the second step would be to program the device to flb and resend the test tone. the return signal would be much lower in amplitude than the first step, indicating the device was active and the internal termination attenuated the return signal. system architectures which dis able the transhybrid function would achieve test coverage with a signal step. once the transhybrid function is disable, program the device for flb and send the test tone. the return signal level is determined by the 4-wire to 4-wire gain of the device. tip open overview the tip open mode (110) is intended for compatibility for pbx type interfaces. used during idle line conditions, the device does not provide transmission. loop supervision is provided by either the switch hook detector (e0 = 1) or the ground key detector (e0 = 0). the ground key detector will be used in most applications. the device may be operated from either high or low battery. functionality during tip open operation, the ti p switch is disabled and the ring switch is enabled. the minimum tip impedance is 30k . the only active path through the device will be the ring switch. in keeping with the mtu characteristics of the device, ring will not exceed -56v when operating from the high battery. though mtu does not apply to tip open, safety requirements are satisfied. power denial overview the power denial mode (111) will shutdown the entire device except for the logic interfac e. loop supervision is not provided. this mode may be used as a sleep mode or to shut down in the presence of a persistent thermal alarm. switching between high and low battery will have no effect during power denial. functionality during power denial, both the tip and ring amplifiers are disabled, representing high impedances. the voltages at both outputs are near ground. thermal shutdown in the event the safe die temperature is exceeded, the alm output will go low and det will go high and the part will automatically shutdown. when the device cools, alm will go high and det will reflect the loop status. if the thermal fault persists, alm will go low again and the part will shutdown. programming power denial will permanently shutdown the device and stop the self cooling cycling. battery switching overview the integrated battery switch selects between the high battery and low battery. the battery switch is controlled with the logic input bsel. when bsel is a logic high, the high battery is selected and when a logic low, the low battery is selected. all opera ting modes of the device will operate from high or low battery except forward loop back. functionality the logic control is independent of the operating mode decode. independent logic control provides the most flexibility and will support all application configurations. when changing device operating states, battery switching should occur simultaneously with or prior to changing the operating mode. in most cases, this will minimize overall power dissipation and prev ent glitches on the det output. the only external component required to support the battery switch is a diode in series with the v bh supply lead. in the event that high battery is re moved, the diode allows the device to transition to low battery operation. low battery operation all off hook operating conditions should use the low battery. the prime benefit will be reduced power dissipation. the typical low battery for the devi ce is -24v. however this may be increased to support longer loop lengths or high loop current requirements. standby conditions may also operate from the low battery if mtu compliance is not required, further reducing standby power dissipation. high battery operation other than ringing, the high battery should be used for standby conditions which must provide mtu compliance. during standby operation the power consumption is typically 85mw with -100v battery. if ringing requirements do not require full 100v operation, then a lower battery will result in lower standby power. hc55185
16 fn4831.14 december 18, 2006 high voltage decoupling the 100v rating of the device will require a capacitor of higher voltage rating for decoupling. suggested decoupling values for all device pins are 0.1 f. standard surface mount ceramic capacitors are rated at 100v. for applications driven at low cost and small size , the decoupling scheme shown below could be implemented. it is important to place the external diode between the vbh pin and the decoupling capacitor. attaching the decoupling capacitor directly to the vbh pin will degrade the reliability of the device. refer to figure 12 for the proper arrangement. this applies to both single and stacked and decoupling arrangements. if vbl and vbh are tied together to override the battery switch function, then the external diode is not needed and the decoupling may be attached directly to vbh. uncommitted switch overview the uncommitted switch is a three terminal device designed for flexibility. the independent logic control input, swc , allows switch operation regardless of device operating mode. the switch is activated by a logic low. the positive and negative terminals of the device are labeled sw+ and sw- respectively. relay driver the uncommitted switch may be used as a relay driver by connecting sw+ to the relay coil and sw- to ground. the switch is designed to have a maximum on voltage of 0.6v with a load current of 45ma. since the device provides the ringing waveform, the relay functions which may be supported include subscriber disconnect, test access or line interface bypass. an external snubber diode is not required when using the uncommitted switch as a relay driver. test load the switch may be used to connect test loads across tip and ring. the test loads can provide external test termination for the device. proper connection of the uncommitted switch to tip and ring is shown in figure 14. the diode in series with the test load blocks current from flowing through the uncommitted switch when the polarity of the tip and ring terminals are reversed. in addition to the reverse active state, the polarity of tip and ring are reversed for half of the ringing cycle. with independent logic control and the blocking diode, the uncommitted switch may be continuously connected to the tip and ring terminals. figure 12. alternate decoupling scheme vbh vbl 0.22 0.22 hc5518x figure 13. external relay switching relay sw+ sw- swc +5v figure 14. test load switching ring tip test load sw+ sw- swc hc55185
17 fn4831.14 december 18, 2006 basic application circuit figure 15. hc55185 basic application circuit v rx v rs tip v fb bgnd agnd ring v tx -in sw+ sw- bsel rd rtd c dc ilim e0 f2 f1 f0 det alm hc55185 v cc pol swc c rx c rs c tx r il c fb r s r sh c rt r rt c pol c dc u 1 r p1 r p2 vcc v bl vbh d 1 c ps1 c ps3 c ps2 tl r tl table 4. basic application circuit component list component value tol rating u1 - ringing slic hc55185 n/a n/a r tl 18.7k 1% 0.1w r rt 23.7k 1% 0.1w r sh 49.9k 1% 0.1w r il 71.5k 1% 0.1w r s 66.5k 1% 0.1w c rx , c rs , c tx , c rt , c pol 0.47 f 20% 10v c dc , c fb 4.7 f 20% 10v c ps1 0.1 f 20% >100v c ps2 , c ps3 0.1 f 20% 100v d 1 1n400x type with breakdown > 100v. r p1 , r p2 standard applications will use 49 per side. protection resistor values are application dependent and will be determined by protection requirements. design parameters : ring trip threshold = 76ma peak , switch hook threshold = 12ma, loop curr ent limit = 24.6ma, synthesize device impedance = (3*66.5k ) /400 = 498.8 , with 49.9 protection resistors, impedance across tip and ring terminals = 599 . transient current limit = 95ma. hc55185
18 fn4831.14 december 18, 2006 pin descriptions plcc qfn symbol description 1 29 tip tip power amplifier output. 2 30 bgnd battery ground - to be connected to zero potential. al l loop current and longitudinal current flow from this ground. internally separate from agnd but it is recommended t hat it is connected to the same potential as agnd. 3 31 vbl low battery supply connection. 4 32 vbh high battery supply connection for the most negative battery. 5 1 sw+ uncommitted switch positive terminal. 6 2 sw- uncommitted switch negative terminal. 7 3 swc switch control input. this ttl compat ible input controls the uncommitted switch , with a logic ?0? enabling the switch and logic ?1? disabling the switch. 8 4 f2 mode control input - msb. f2-f0 for the ttl compatible pa rallel control interface for cont rolling the various modes of operation of the device. 9 5 f1 mode control input. 10 6 f0 mode control input. 11 7 e0 detector output selection input. this ttl input controls the multiplexing of the shd (e0 = 1) and gkd (e0 = 0) comparator outputs to the det output based upon the state at the f2-f0 pins (see the device operating modes table shown on page 2). 12 9 det detector output - this ttl output provides on-hook/o ff-hook status of the loop based upon the selected operating mode. the detected output will either be switch hook, ground key or ring trip (see the device operating modes table shown on page 2). 13 10 alm thermal shutdown alarm. this pin signals the inter nal die temperature has exceeded safe operating temperature (approximately 175c) and the device has been powered down automatically. 14 11 agnd analog ground reference. this pi n should be externally connected to bgnd. 15 12 bsel selects between high and low battery, with a logic ?1 ? selecting the high battery and logic ?0? the low battery. 16 13 tl programming pin for the transient current limi t feature, set by an external resistor to ground. 17 14 pol external capacitor on this pin sets the polarity reversal time. 18 15 vrs ringing signal input - analog input for driving 2-wire interface while in ring mode. 19 17 vrx analog receive voltage - 4-wire analog audio input voltage. ac couples to codec. 20 18 vtx transmit output voltage - output of im pedance matching amplifier, ac couples to codec. 21 19 vfb feedback voltage for impedance matching. this vo ltage is scaled to accomplish impedance matching. 22 20 -in impedance matching amplifier summing node. 23 21 vcc positive voltage power supply, usually +5v. 24 22 cdc dc biasing filter capacitor - connects between this pin and v cc . 25 23 rtd ring trip filter network. 26 24 ilim loop current limit programming resistor. 27 25 rd switch hook detection th reshold programming resistor. 28 27 ring ring power amplifier output. hc55185
19 fn4831.14 december 18, 2006 hc55185 quad flat no-lead plastic package (qfn) index d1/2 d1 d/2 d e1/2 e/2 e a 2x 0.15 b c 0.10 b a mc a n seating plane n 6 3 2 2 3 e 1 1 0.08 for odd terminal/side for even terminal/side c c section "c-c" nx b a1 c 2x c 0.15 0.15 2x b 0 ref. (nd-1)xe (ne-1)xe ref. 5 a1 4x p a c c 4x p b 2x a c 0.15 a2 a3 d2 d2 e2 e2/2 terminal tip side view top view 7 bottom view 7 5 c l c l e e e1 2 nx k nx b 8 nx l 8 8 9 area 9 4x 0.10 c / / 9 (datum b) (datum a) area index 6 area n 9 corner option 4x l1 l 10 l1 l 10 l32.7x7 32 lead quad flat no-lead plastic package (compliant to jedec mo-220vkkc issue c) symbol millimeters notes min typ max a0.800.90 1.00 - a1 - - 0.05 - a2 - - 1.00 9 a3 0.20 ref 9 b 0.23 0.28 0.38 5, 8 d 7.00 bsc - d1 6.75 bsc 9 d2 4.55 4.70 4.85 7, 8 e 7.00 bsc - e1 6.75 bsc 9 e2 4.55 4.70 4.85 7, 8 e 0.65 bsc - k 0.25 --- l 0.50 0.60 0.75 8 l1 - - 0.15 10 n322 nd 8 3 ne 8 3 p- - 0.60 9 --129 rev. 4 8/03 notes: 1. dimensioning and tolerancing conform to asme y14.5-1994. 2. n is the number of terminals. 3. nd and ne refer to the number of terminals on each d and e. 4. all dimensions are in millimeters. angles are in degrees. 5. dimension b applies to the me tallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 6. the configuration of the pin #1 identifier is optional, but must be located within the zone indicated. the pin #1 identifier may be either a mold or mark feature. 7. dimensions d2 and e2 are fo r the exposed pads which provide improved electrical and thermal performance. 8. nominal dimensions are prov ided to assist with pcb land pattern design efforts, see intersil technical brief tb389. 9. features and dimensions a2, a3, d1, e1, p & are present when anvil singulation method is used and not present for saw singulation. 10. depending on the method of lead termination at the edge of the package, a maximum 0.15mm pull back (l1) maybe present. l minus l1 to be equal to or greater than 0.3mm.
20 all intersil u.s. products are manufactured, asse mbled and tested utilizing iso9000 quality systems. intersil corporation?s quality certifications ca n be viewed at www.intersil.com/design/quality intersil products are sold by description only. intersil corpor ation reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. accordingly, the reader is cautioned to verify that data sheets are current before placing orders. information furnishe d by intersil is believed to be accurate and reliable. however, no responsibility is assumed by intersil or its subsidiaries for its use; nor for any infringements of paten ts or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of intersil or its subsidiari es. for information regarding intersil corporation and its products, see www.intersil.com fn4831.14 december 18, 2006 hc55185 plastic leaded chip carrier packages (plcc) notes: 1. controlling dimension: inch. c onverted millimeter dimensions are not necessarily exact. 2. dimensions and tolerancing per ansi y14.5m-1982. 3. dimensions d1 and e1 do not include mold protrusions. allowable mold protrusion is 0.010 inch (0.25mm) per side. dimensions d1 and e1 include mold mismatch and are measured at the extreme material condition at the body parting line. 4. to be measured at seating plane contact point. 5. centerline to be determined where center leads exit plastic body. 6. ?n? is the number of terminal positions. -c- a1 a seating plane 0.020 (0.51) min view ?a? d2/e2 0.025 (0.64) 0.045 (1.14) r 0.042 (1.07) 0.056 (1.42) 0.050 (1.27) tp e e1 0.042 (1.07) 0.048 (1.22) pin (1) identifier c l d1 d 0.020 (0.51) max 3 plcs 0.026 (0.66) 0.032 (0.81) 0.045 (1.14) min 0.013 (0.33) 0.021 (0.53) 0.025 (0.64) min view ?a? typ. 0.004 (0.10) c -c- d2/e2 c l n28.45 (jedec ms-018ab issue a) 28 lead plastic leaded chip carrier package symbol inches millimeters notes min max min max a 0.165 0.180 4.20 4.57 - a1 0.090 0.120 2.29 3.04 - d 0.485 0.495 12.32 12.57 - d1 0.450 0.456 11.43 11.58 3 d2 0.191 0.219 4.86 5.56 4, 5 e 0.485 0.495 12.32 12.57 - e1 0.450 0.456 11.43 11.58 3 e2 0.191 0.219 4.86 5.56 4, 5 n28 286 rev. 2 11/97

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